Produced by: Mohsin Shaikh
A €37 billion semiconductor initiative has been launched by China, signaling its intent to break free from Western control. With photolithography as its primary target, Beijing aims to challenge ASML’s monopoly on high-end chipmaking.
ASML, the Dutch giant, is the sole supplier of EUV lithography machines—the essential tech behind cutting-edge chips. Without these machines, China remains generations behind, relying on outdated semiconductor technology.
For years, the U.S. and its allies have restricted China’s access to ASML’s EUV machines, fearing technological dominance. The move has slowed China’s progress, but Beijing is now racing to build its own alternative.
The launch of Huawei’s Mate 60 Pro, powered by a 7nm chip despite U.S. sanctions, proved China’s semiconductor resilience. The device, manufactured by SMIC, demonstrated that restrictions hadn’t crippled China’s chipmaking capabilities.
China’s €37 billion investment in lithography is its most aggressive counterstrike yet. If successful, it could bypass Western suppliers entirely, gaining self-sufficiency in AI, cybersecurity, and military technology.
ASML is developing High-NA EUV technology, enabling sub-2nm chip production—far ahead of China’s current capabilities. The question is, how long will ASML’s lead last before China catches up?
Dr. Ming Zhao, a semiconductor analyst at Tech Policy Journal, warns that “China’s push into photolithography could upend the global chip hierarchy, forcing the West to rethink its long-term strategy.”
With tensions rising, China isn’t just focusing on chipmaking—it’s building an entire supply chain, from raw materials to advanced fabrication plants. If successful, it could reshape the industry’s power balance.
If China masters photolithography, the West’s semiconductor dominance could crumble. But failure would leave China locked out of next-gen chip production, prolonging its dependence on outdated technology.